Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
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DOI：
10.1007/s11664-000-0019-2
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发表时间：
2000-10
影响因子：
2.1
通讯作者：
F. Guo;S. Choi;J. P. Lucas;K. N. Subramanian
中科院分区：
文献类型：
--
作者：
F. Guo;S. Choi;J. P. Lucas;K. N. Subramanian
电子应用中使用的焊接接头需要进行回流焊操作。这样的操作会影响可焊性、界面金属间化合物层的形成和所得的焊点微观结构。这些反过来又会影响此类接头的整体机械性能。在这项研究中，回流对可焊性和机械性能的影响进行了研究。纳米压痕测试（NIT）被用来获得机械性能的非回流焊（熔化）和多次回流焊的焊料材料。这些研究进行了共晶Sn-3.5Ag焊料，有或没有机械添加的Cu或Ag增强，使用Cu基板。采用相同的焊料，使用铜基板上的焊点进行了显微组织分析。
Solder joints used in electronic applications undergo reflow operations. Such operations can affect the solderability, interface intermetallic layer formation and the resultant solder joint microstructure. These in turn can affect the overall mechanical behavior of such joints. In this study the effects of reflow on solderability and mechanical properties were studied. Nanoindentation testing (NIT) was used to obtain mechanical properties from the non-reflow (as-melted) and multiple reflowed solder materials. These studies were carried out with eutectic Sn-3.5Ag solders, with or without mechanically added Cu or Ag reinforcements, using Cu substrates. Microstructural analysis was carried out on solder joints made with the same solders using copper substrate.