C/SiO2 meta-composite: Overcoming the λ/a relationship limitation in metamaterials

C/SiO2 meta-composite: Overcoming the λ/a relationship limitation in metamaterials
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C/SiO2 超复合材料:克服超材料中的 lambda/a 关系限制

DOI:
10.1016/j.carbon.2017.09.021
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发表时间:
2017-12-01
期刊:
影响因子:
10.9
通讯作者:
Dou, Shixue
Dou, Shixue
中科院分区:
材料科学2区
文献类型:
--
作者:
Xie, Peitao;Zhang, Zidong;Dou, Shixue

文献摘要

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超材料通常要求单位尺寸a应该与波长λ相当。虽然λ/a关系可以告诉我们需要什么尺寸的单元以及我们应该选择哪种方法来制造,但它限制了超材料在kHz和MHz频率范围内的应用,因为单元尺寸将在10(2)m的量级上,使得超材料的整体尺寸对于实际应用来说太大。我们首先证明λ/A关系的限制可以通过一种新的复合材料来克服,我们称之为碳基“元复合材料”。利用SiO2微球自组装技术制备出具有周期性微结构的SiO2基体,无定形碳填充其中形成三维周期性碳网络。实验结果表明,碳网络将引入可调的电磁性能,这可以通过控制碳网络的几何尺寸精确定制。值得指出的是,周期性碳网络的单位尺寸在亚微米级,但波长在10(2)m的量级。这意味着元复合材料克服了kHz和MHz频率范围内的λ/a关系限制,这显示出电子器件小型化的巨大潜力。(C)2017爱思唯尔有限公司版权所有
Metamaterials usually require that the unit size a should be comparable to the wavelength lambda. Although the lambda/a relationship could tell us what size of unit we need and which method we should choose for the fabrication, it limits the application of metamaterials in the kHz and MHz frequency range, as the unit size would be on the order of 10(2) m, making the overall size of the metamaterial too large for practical application.In this paper, we firstly demonstrate that the lambda/a relationship limitation could be overcome by a new kind of composite, which we have called carbon-based 'meta-composite'. A SiO2 matrix with periodic microstructure is fabricated by using self-assembly of SiO2 microspheres, and amorphous carbon fills in the gaps to form a three-dimensional periodic carbon network. The experimental results indicate that the carbon network will introduce tunable electromagnetic properties, which could be precisely tailored by controlling the geometric size of the carbon network. It is worth pointing out that the unit size of the periodic carbon network is on the sub-micrometre level, but the wavelength is on the order of 10(2) m. This means that the meta-composite overcomes the lambda/a relationship limitation in the kHz and MHz frequency range, which shows great potential for the miniaturization of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved.