Fused filament fabrication of void-free parts using low viscosity hot melt adhesives
Fused filament fabrication of void-free parts using low viscosity hot melt adhesives
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DOI：
10.1016/j.addma.2021.102110
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发表时间：
2021-10-01
影响因子：
11
通讯作者：
Peterson, Amy M.
中科院分区：
文献类型：
--
作者：
Pourali, Masoumeh;Peterson, Amy M.
在这项工作中，对聚酰胺热熔胶作为材料挤出增材制造 (AM) 的原料进行了评估。这种粘合剂 Technomelt PA 6910 是一种半结晶聚合物，具有低于环境的玻璃化转变温度、中等熔化温度和较低的再结晶温度。由于具有这些特性，Technomelt PA 6910 是一种室温柔性材料，具有高韧性和强度以及良好的附着力。 Technomelt PA 6910 被挤出成细丝形式，并使用熔丝制造 (FFF)（一种桌面形式的材料挤出增材制造）进行打印。研究了挤出机温度对印刷品质量和机械性能的影响以及光栅角度和层高对印刷品机械性能的影响。优化的打印参数以及材料的低粘度导致了无空隙打印，其各向同性拉伸性能与压缩成型值相当或更好。这项工作拓宽了 FFF 的材料窗口，并证明热熔粘合剂可用于增材制造光学透明的柔性结构，其失效应变可达 1,200% 以上。 Technomelt PA 6910 的机械性能与作为多功能加工技术的 FFF 相结合，使该材料成为各种需要透明度、设计复杂性以及在各种温度下具有灵活性的应用的候选材料。
In this work, a polyamide hot melt adhesive was evaluated as a feedstock for material extrusion additive manufacturing (AM). This adhesive, Technomelt PA 6910, is a semicrystalline polymer with a sub-ambient glass transition temperature, intermediate melting temperatures, and low recrystallization temperature. Due to this combination of properties, Technomelt PA 6910 is a room temperature flexible material that exhibits high toughness and strength, and good adhesion. Technomelt PA 6910 was extruded into filament form and printed using fused filament fabrication (FFF), a desktop form of material extrusion AM. The effect of extruder temperature on print quality and mechanical properties and the effect of raster angle and layer height on mechanical properties of prints were studied. Optimized print parameters, as well as the material's low viscosity, resulted in void-free prints that exhibited isotropic tensile properties comparable to or better than compression molded values. This work broadens the material window for FFF and demonstrates that hot melt adhesives can be used to additively manufacture optically transparent, flexible structures capable of >1,200% strain to failure. The mechanical properties of Technomelt PA 6910, combined with FFF as a versatile processing technique, make this material a candidate for a variety of applications in which transparency, design complexity, and flexibility at a wide range of temperatures are desired.