Experimental investigations on the laser-assisted machining of single crystal Si for optimal machining
Experimental investigations on the laser-assisted machining of single crystal Si for optimal machining
复制标题
单晶硅激光辅助加工优化加工的实验研究
DOI：
10.1016/j.optlastec.2021.107113
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发表时间：
2021-04-11
影响因子：
5
通讯作者：
Zhang, Wanqing
中科院分区：
文献类型：
--
作者：
Guo, Yanjun;Yang, Xiaojing;Zhang, Wanqing
单晶硅是典型的红外光学材料，广泛应用于透镜、棱镜、窗口片、滤光片等红外光学系统。但其高脆性、高硬度和低断裂韧性使其难以采用传统加工（CM）进行加工。近年来，激光辅助加工（LAM）方法已成为单晶硅加工的一种有前景的解决方案。本文基于田口法（TM）和响应面法（RSM），实验研究了主轴转速、进给速度、切削深度和激光脉冲占空比对单晶硅激光加工过程中表面粗糙度的影响。使用正交阵列和Box-Behnken设计来设计实验。测量方差分析、信噪比、主效应图、3D响应面和相应的等值线图，以评估因素对表面粗糙度的影响。基于RSM，建立了工艺参数与表面粗糙度之间的回归模型。 LAM 的实验结果表明，与 CM 相比，通过提高表面质量、提高材料去除率以及降低表面粗糙度，单晶硅的切削加工性得到了显着改善。主轴转速、进给速度、切削深度和脉冲占空比对表面粗糙度的贡献率分别为21.85%、39.95%、10.29%和14.27%。根据3D响应面，不同因素之间的相互作用对表面粗糙度有显着影响。采用方差分析和响应优化来寻找 LAM 的最佳加工条件。最终确定最佳参数组合为：主轴转速4000rpm、进给速度2mm/min、切削深度5.86μm、脉冲占空比27.60%。测量的粗糙度的最大值为1.9nm。
Single crystal Si is a typical infrared optical material, which is widely used in infrared optical systems such as lenses, prisms, windows and filters. But its high brittleness, hardness, and low fracture toughness make it difficult to machine using conventional machining (CM). Laser-assisted machining (LAM) method has become a promising solution for the machining of single crystal Si in recent years. This paper investigated experimentally the effect of spindle speed, feed speed, cutting depth, and laser pulse duty cycle on the surface roughness during the LAM of single crystal Si based on the Taguchi method (TM) and Response surface methodology (RSM). Orthogonal array and Box-Behnken design were used to design the experiment. Analysis of variance, signal-tonoise ratio, main effect plots, 3D response surface, and corresponding contour plots were measured to evaluate the effect of factors on the surface roughness. Based on RSM, a regression model between process parameters and surface roughness was established. The experimental results on LAM demonstrated a considerable improvement in the machinability of single crystal Si through the improved surface quality, high material removal rate, as well as the surface roughness reduction, compared to CM. The contribution rates of spindle speed, feed speed, cutting depth and pulse duty cycle to surface roughness were 21.85%, 39.95%, 10.29% and 14.27%, respectively. According to the 3D response surface, the interaction between different factors had a significant effect on the surface roughness. ANOVA and response optimization were employed to find optimal machining conditions for LAM. Finally, the Optimal parametric combination was as following: a spindle speed of 4000 rpm, a feed speed of 2 mm/min, a cutting depth of 5.86 mu m, and a pulse duty cycle of 27.60%. The maximum value of measured roughness was 1.9 nm.