Corrosion behaviour of commercially pure titanium shot blasted with different materials and sizes of shot particles for dental implant applications
Corrosion behaviour of commercially pure titanium shot blasted with different materials and sizes of shot particles for dental implant applications
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DOI：
10.1016/s0142-9612(02)00314-9
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发表时间：
2003-01-01
期刊：
影响因子：
14
通讯作者：
Planell, JA
中科院分区：
文献类型：
--
作者：
Aparicio, C;Gil, FJ;Planell, JA
众所周知，当对金属进行喷丸处理以增加其表面粗糙度时，商业纯钛（c.p. Ti）牙种植体的骨整合得到改善。这种粗糙度被骨定植，这改善了植入物固定。然而，喷丸处理也会改变植入物表面的化学成分，因为一些喷丸颗粒仍然粘附在金属上。对采用不同材料和尺寸的喷丸颗粒进行喷丸处理的c.p. Ti表面进行了测试，以确定其形貌特征（表面粗糙度、真实的表面积和被粘附的弹丸颗粒覆盖的表面的百分比）和电化学行为结果表明，由于增加的表面粗糙度而增加的材料表面积不是在喷砂的c.p.Ti的电化学行为和耐腐蚀性中发现的差异的唯一原因。在其他可能的原因中，这些差异可能归因于喷丸处理引起的压缩残余表面应力。所有测试的材料都具有足够的腐蚀和电化学行为，可以用作牙科种植体材料。(C)2002爱思唯尔科技有限公司版权所有。
It is well known that the osseointegration of the commercially pure titanium (c.p. Ti) dental implant is improved when the metal is shot blasted in order to increase its surface roughness. This roughness is colonised by bone, which improves implant fixation. However, shot blasting also changes the chemical composition of the implant surface because some shot particles remain adhered on the metal.The c.p. Ti surfaces shot blasted with different materials and sizes of shot particles were tested in order to determine their topographical features (surface roughness, real surface area and the percentage of surface covered by the adhered shot particles) and electrochemical behaviour (open circuit potential, electrochemical impedance spectroscopy and cyclic polarisation).The results demonstrate that the increased surface area of the material because of the increasing surface roughness is not the only cause for differences found in the electrochemical behaviour and corrosion resistance of the blasted c.p. Ti. Among other possible causes, those differences may be attributed to the compressive residual surface stresses induced by shot blasting.All the materials tested have an adequate corrosion and electrochemical behaviour in terms of its possible use as dental implant material. (C) 2002 Elsevier Science Ltd. All rights reserved.