Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders
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DOI：
10.1016/j.memori.2023.100026
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发表时间：
2023-01
期刊：
Memories - Materials, Devices, Circuits and Systems
影响因子：
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通讯作者：
Gui-Sheng Gan;Tian Huang;Shi-Qi Chen;Liujie Jiang;Dayong Cheng;Shuye Zhang
Gui-Sheng Gan;Tian Huang;Shi-Qi Chen;Liujie Jiang;Dayong Cheng;Shuye Zhang
中科院分区：
其他
文献类型：
--
作者：
Gui-Sheng Gan;Tian Huang;Shi-Qi Chen;Liujie Jiang;Dayong Cheng;Shuye Zhang

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