Matrix-filler interfaces and physical properties of metal matrix composites with negative thermal expansion manganese nitride
Matrix-filler interfaces and physical properties of metal matrix composites with negative thermal expansion manganese nitride
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负热膨胀氮化锰金属基复合材料的基体-填料界面及物理性能
DOI：
10.1109/tim.2014.2381732
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发表时间：
2015
影响因子：
3.2
通讯作者：
and N. Sugimoto
中科院分区：
文献类型：
--
作者：
K. Takenaka;K. Kuzuoka;and N. Sugimoto
反钙钛矿锰氮化物化合物Mn 3Ag 1-xCuxN在室温附近具有与锰铜合金相当的宽的磁导率-温度曲线。该曲率和峰值温度可以通过用Cu和In或Fe共掺杂来调节。电阻值的漂移速率受四端接触条件和样品形状的强烈影响。具有点焊触点的样品显示出比具有Ag膏触点的样品更低的电阻漂移率。四端形状的样品具有比正常长方体形状的样品低80倍的漂移率。我们证实，Mn 3AgN样品对铜具有足够低的热电动势，其小于每开尔文几微伏。我们期望这种反钙钛矿化合物可以用作精密电阻器的材料，并可以改善电阻器的温度系数，用于开发计量标准。
The antiperovskite manganese nitride compound Mn3Ag1-xCuxN has a broad resistivity-temperature curve around room temperature that is comparable with the Manganin alloy. This curvature and the peak temperature can be adjusted by codoping with Cu and In or Fe. The drift rate of the resistance value was strongly affected by the condition of the four-terminal contact and the shape of the sample. Samples with spot-welded contacts show lower resistance drift rates than samples with Ag-paste contacts. The four-terminal-shaped sample has a drift rate that is 80 times lower than the normal cuboid-shaped sample. We confirmed that the Mn3AgN sample has a sufficiently low-thermal electromotive force against copper that is less than a few microvolts per kelvin. We expect that this antiperovskite compound could be used as a material for precision resistors and could improve the temperature coefficient of resistors for developing metrology standards.