An Automated Detection Method of Solder Joint Defects Using 3D Computed Tomography for IC Package Inspection
An Automated Detection Method of Solder Joint Defects Using 3D Computed Tomography for IC Package Inspection
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一种使用 3D 计算机断层扫描进行 IC 封装检测的焊点缺陷自动检测方法
DOI：
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发表时间：
2011
期刊：
影响因子：
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通讯作者：
Y. Shin
中科院分区：
文献类型：
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作者：
Junhyuk Yoon;Jeongjin Lee;Bohyoung Kim;Y. Shin
最近的电子零件在尺寸上继续缩小，因此更有可能出现缺陷。最近，计算机断层扫描技术被引入，为电子封装的内部检测提供了有用的工具。本文提出了一种检测3D封装器件中焊点缺陷的新方法。我们的方法由三个步骤组成。首先，校正CT扫描过程中的未对准。其次，使用斑点标记程序检测开放焊点、缺失焊点和焊桥。最后利用主曲率分析对枕头缺陷进行了检测。实验结果表明，该方法能够在不到1秒的时间内准确检测出焊点缺陷。我们的方法可以成功地应用于在线制造，这需要对整个芯片进行快速检查。
Recent electronics parts continue to decrease in size so that it is more likely to exhibit defects. Lately, computed tomography scanning technique has been introduced to provide useful tools for the internal inspection of electronic packages. In this paper, we presents a novel method for detecting solder joint defects in the 3D packaging devices. Our method is composed of three steps. First, mis-alignment during the CT scan process is corrected. Second, open solder joints, missing solder joints, and solder bridges are detected usingblob labeling procedure. Finally, head-in-pillow defect is inspected by the principal curvature analysis. The experimental results demonstrated that our method accurately detected solder joint defects within less than one second. Our method can be successfully applied to inline manufacturing, which requires rapid inspection of whole chips.