A cymbal transducer for power ultrasonics applications
A cymbal transducer for power ultrasonics applications
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DOI：
10.1016/j.sna.2014.02.024
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发表时间：
2014-04-01
影响因子：
4.6
通讯作者：
Lucas, Margaret
中科院分区：
文献类型：
--
作者：
Bejarano, Fernando;Feeney, Andrew;Lucas, Margaret
伸缩型V‘Cymbal’换能器已被广泛应用于低功率超声波应用，与用作驱动器的单个陶瓷相比，该换能器在低输入能量下表现出高输出位移。尽管Cymbal换能器具有性能优势，但对于需要高得多输出位移的高功率超声波应用来说，其原始设计存在固有的缺陷。制造过程中引入的不对称降低了换能器的效率，端盖和电活性材料之间的粘合层的退化可能会改变振动响应，最终导致故障。因此，提出了一种可提供高输出位移的Cymbal换能器的新设计。比较了基于原设计构型的Cymbal和新的Cymbal，论证了输入电压水平对两种不同换能器动态特性和振动响应的影响。对于第一个Cymbal，使用商用非导电环氧树脂将端盖直接粘接到压电陶瓷盘上。第二Cymbal结合了粘结到压电盘外缘的金属环，以改善与端盖的机械耦合，从而增强了器件在较高电压下的操作能力，允许通过消除与环氧层中的故障相关的问题来激励更高的输出位移。这种设计被证明特别适用于功率超声波应用，例如微型外科设备，例如用于骨科程序的钻孔和切割设备。(C)2014年提交人。爱思唯尔出版公司(Elsevier B.V.)
The flextensional class V 'cymbal' transducer has been widely adopted for low power ultrasonics applications, exhibiting high output displacement for low input energy, compared to a single ceramic, when used as an actuator. Despite its performance benefits, the original designs of cymbal transducers have inherent drawbacks for high power ultrasonics applications that require much higher output displacements. Asymmetries introduced during the fabrication process reduce the efficiency of the transducer, and degradation of the bonding layer between the end-caps and the electroactive material can alter the vibration response and ultimately lead to failure. A new design of the cymbal transducer is therefore proposed that delivers high output displacements. A comparison is presented between a cymbal based on the original design configuration and a new cymbal, to demonstrate the effects of input voltage levels on the dynamic characteristics and vibration response of the two different transducers. For the first cymbal the end-caps are directly bonded to the piezoceramic disc using a commercial non-conductive epoxy. The second cymbal incorporates a metal ring bonded to the outer edge of the piezoceramic disc to improve the mechanical coupling with the end-caps, thereby enhancing the operational capability of the device at higher voltages, allowing for excitation of higher output displacements by removing the problems associated with failure in the epoxy layer. This design is demonstrated to be particularly suitable for power ultrasonics applications such as miniature surgical devices, for example as drilling and cutting devices for orthopaedics procedures. (C) 2014 The Authors. Published by Elsevier B.V.