Microstructural Evolution and Applied Performance of a Highly Undercooled Bulk Ni-5% Cu Alloy
Microstructural Evolution and Applied Performance of a Highly Undercooled Bulk Ni-5% Cu Alloy
复制标题
微观结构%20进化%20和%20应用%20性能%20of%20a%20高度%20过冷%20散装%20Ni-5%%20Cu%20合金
DOI：
10.1007/s11665-022-07626-2
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发表时间：
2022
影响因子：
2.3
通讯作者：
Yan Na
中科院分区：
文献类型：
--
作者：
Li Jinzhan;Yan Na
高度过冷快速凝固是研究金属材料亚稳凝固的重要方法。本文采用玻璃助熔剂技术研究了过冷度为53 ~ 380 K的大块Ni-5% Cu合金的显微组织演变和应用性能特征。随着过冷度的增加，组织均匀性增强，晶粒细化程度提高。随着过冷度的增加，整体组织由粗大的枝晶组织转变为精细的等轴晶组织。此外，EDS结果表明，在高过冷条件下，凝固偏析较少，溶质捕获效果显著。随着熔体过冷度的增加，大块Ni-5% Cu合金的抗压屈服强度、维氏硬度和弯曲模量均增加。此外，合金的软磁性能随过冷度的变化而变化。
Rapid solidification with a high degree of undercooling is an important method for investigating the metastable solidification of metallic materials. In this paper, we study the microstructural evolution and applied performance characteristics of bulk Ni-5% Cu alloys with degrees of undercooling ranging from 53 to 380 K by a glass fluxing technique. The microstructure homogeneity increases, and the grain refinement increases with increasing degree of undercooling. The global microstructure transforms from a coarse dendrite microstructure into a refined equiaxed grain microstructure as the degree of undercooling increases. Additionally, EDS results illustrate that the segregation less solidification with a remarkable solute trapping effect is preferentially achieved under high undercooling conditions. The compressive yield strength, Vickers hardness and bending modulus of the bulk Ni-5% Cu alloy all increase with increasing melt undercooling. Moreover, the soft magnetic properties of the alloy are modulated when the degree of undercooling changes.