Thermal analysis of grinding
Thermal analysis of grinding
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DOI：
10.1016/j.cirp.2007.10.005
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发表时间：
2007-01-01
影响因子：
4.1
通讯作者：
Guo, C.
中科院分区：
文献类型：
--
作者：
Malkin, S.;Guo, C.
热损伤是磨削过程的主要限制之一，因此了解影响磨削温度的因素非常重要。本文综述了磨削温度的分析计算方法及其对热损伤的影响。一般的分析方法包括建模的磨削区作为一个热源，沿沿着工件表面移动。计算磨削温度的一个关键因素是能量分配，这是磨削能量在磨削区作为热量传递到工件的分数。对于用常规砂轮进行浅切削磨削，能量分配通常为60%-85%。然而，对于低速大切深的缓进给磨削，能量分配仅为5%左右。这种低能量分区归因于研磨区的流体冷却。对颗粒的热传导也可以减少能量分配，尤其是对于具有高导热性的CBN磨料。对于使用具有大切削深度和快速工作速度的CBN砂轮的高效深度磨削（HEDG），磨削区前面的预热材料与切屑一起被去除，从而降低了成品表面的温度。分析模型已经开发，考虑到所有这些影响。需要更多的研究来更好地了解和量化磨削温度如何影响成品工件的表面完整性。
Thermal damage is one of the main limitations of the grinding process, so it is important to understand the factors which affect grinding temperatures. This paper presents an overview of analytical methods to calculate grinding temperatures and their effect on thermal damage. The general analytical approach consists of modeling the grinding zone as a heat source which moves along the workpiece surface. A critical factor for calculating grinding temperatures is the energy partition, which is the fraction of the grinding energy transported as heat to the workpiece at the grinding zone. For shallow cut grinding with conventional abrasive wheels, the energy partition is typically 60%-85%. However for creep-feed grinding with slow workspeeds and large depths of cut, the energy partition is only about 5%. Such low energy partitions are attributed to cooling by the fluid at the grinding zone. Heat conduction to the grains can also reduce the energy partition especially with CBN abrasives which have high thermal conductivity. For High Efficiency Deep Grinding (HEDG) using CBN wheels with large depths of cut and fast workspeeds, preheated material ahead of the grinding zone is removed together with the chips, thereby lowering the temperature on the finished surface. Analytical models have been developed which take all of these effects into account. Much more research is needed to better understand and quantify how grinding temperatures affect the surface integrity of the finished workpiece.