Temperature dependence of fracture toughness of silica/epoxy composites: Related to microstructure of nano- and micro-particles packing
Temperature dependence of fracture toughness of silica/epoxy composites: Related to microstructure of nano- and micro-particles packing
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DOI：
10.1016/j.compositesb.2007.10.008
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发表时间：
2008-01-01
影响因子：
13.1
通讯作者：
Araki, Wakako
中科院分区：
文献类型：
--
作者：
Kwon, Soon-Chul;Adachi, Tadaharu;Araki, Wakako
研究了纳米和微硅增强环氧复合材料断裂韧性的温度依赖性。在固定体积分数（V-p = 0.30）下，制备了含不同组成比φ (SP)的球形纳米和微二氧化硅颗粒（240 nm和1.56 μ m）的环氧复合材料。分别在143、185、228、296、363、399 K温度下测定了复合材料和纯环氧树脂的热粘弹性和断裂韧性。实验结果表明，在所有温度下，断裂韧性主要取决于纳米和微观颗粒的微观结构及其与基体的相互作用，而在松弛温度下，由于基体迁移率的增加，断裂韧性主要取决于基体的增韧。(c) 2007 Elsevier Ltd.版权所有。
Temperature dependence of the fracture toughness of epoxy composites reinforced with nano- and micro-silica particles was evaluated. Epoxy composites containing varied composition ratios Phi(SP) of spherical nano- and micro-silica particles, 240 nm and 1.56 mu m, were prepared at a fixed volume fraction (V-p = 0.30). The thermo-viscoelasticity and fracture toughness of the composites and neat epoxy were measured at 143 K, 185 K, 228 K, 296 K, 363 K, and 399 K. Experimental results revealed that fracture toughness strongly depended on the microstructure of nano- and micro-particles bidispersion as well as its interactions with the matrix at all temperature, but depended on toughened matrix due to increase in mobility of matrix at the relaxation temperatures. (c) 2007 Elsevier Ltd. All rights reserved.