Development of a Thermal Buffering Device to Cope with Temperature Fluctuations for a Thermoelectric Power Generator

Development of a Thermal Buffering Device to Cope with Temperature Fluctuations for a Thermoelectric Power Generator
复制标题

DOI:
10.1007/s11664-012-1911-2
复制
发表时间:
2012-02
影响因子:
2.1
通讯作者:
K. Mizuno;Kazunori Sawada;T. Nemoto;T. Iida
K. Mizuno;Kazunori Sawada;T. Nemoto;T. Iida
中科院分区:
工程技术4区
文献类型:
--
作者:
K. Mizuno;Kazunori Sawada;T. Nemoto;T. Iida

文献摘要

被引文献

相似文献

为了稳定热电发生器(TEG)的热输入并保护其免受大的温度波动的影响,使用典型的Bi-Te TEG模块和全新的Mg 2Si TEG模块制作并测试了热缓冲装置(TBD)。TBD包括两个相邻的储热容器,每个储热容器包含不同的合金,可以针对TEG的温度范围进行优化。两种合金的串联组合减少了热波动,稳定了TEG模块的热输入。这是通过将两种具有大熔化率的金属材料放置在热源和TEG之间来实现的。对于Bi-Te TEG,15 Al-85 Zn和30 Sn-70 Zn合金分别用于热源侧和TEG侧。用于Mg 2Si TEG的相应合金为20 Ni-80 Al和7Si-93 Al。在使用TBD的情况下,Bi-Te TEG即使在超过573 K的相当高的温度范围内也没有表现出明显的损坏。对于Mg 2Si TEG,即使在1020 K的温度下也没有观察到Mg 2Si TEG模块的操作损坏。
To stabilize the heat input to a thermoelectric generator (TEG) and protect it from large temperature fluctuations, a thermal buffering device (TBD) was fabricated and examined using a typical Bi-Te TEG module and a brand-new Mg2Si TEG module. The TBD comprises two adjoining heat storage containers, each containing different alloys, which can be optimized for the temperature range of the TEG. The combination of two alloys in series diminishes the thermal fluctuations, stabilizing the heat input to the TEG module. This is achieved by having two metallic materials with large enthalpies of fusion that can be placed between the heat source and the TEG. The combination of the two alloys can be optimized for the temperature ranges of Bi-Te, Pb-Te, or Co-Sb. For the Bi-Te TEG, 15Al-85Zn and 30Sn-70Zn alloys were used for the heat source side and the TEG side, respectively. The corresponding alloys for the Mg2Si TEG were 20Ni-80Al and 7Si-93Al. With the use of a TBD, the Bi-Te TEG exhibited no notable damage even in the rather high temperature range beyond ∼573 K. For the Mg2Si TEG, no operational damage of the Mg2Si TEG module was observed even with a temperature of 1020 K.