Characterization of Hydrogen Bonding Formation and Breaking in Semiconducting Polymers under Mechanical Strain
Characterization of Hydrogen Bonding Formation and Breaking in Semiconducting Polymers under Mechanical Strain
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DOI：
10.1021/acs.macromol.9b00145
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发表时间：
2019-03-26
期刊：
影响因子：
5.5
通讯作者：
Bao, Zhenan
中科院分区：
文献类型：
--
作者：
Gasperini, Andrea;Wang, Ging-Ji Nathan;Bao, Zhenan
制备并研究了以二酮吡咯（DPP）为基础，在烷基侧链端基插入2,6-吡啶二羧基酰胺（PDCA）作为弱氢键单元的给受体共轭聚合物。与先前报道的含有PDCA单元的DPP聚合物不同，即使在低PDCA单元含量的情况下，烷基侧链上的PDCA也很容易产生几乎定量的分子间氢键形成(
Diketopyrrolopyrrole (DPP)-based donor-acceptor conjugated polymers, with increasing amount of weak H-bonding units, namely 2,6-pyridinedicarboxamide (PDCA), inserted as end groups in alkyl side chains were prepared and investigated. In contrast to previously reported DPP polymers containing PDCA units as conjugation breakers along the polymer backbone, PDCA in the alkyl side chains readily produced almost quantitative formation of intermolecular H-bonding even at low PDCA unit content (