On-chip interconnects: giga hertz and beyond
On-chip interconnects: giga hertz and beyond
复制标题
片上互连：千兆赫兹及以上
DOI：
10.1109/iitc.1998.704739
复制
发表时间：
1998
期刊：
影响因子：
--
通讯作者：
K. Lee
中科院分区：
文献类型：
--
作者：
K. Lee
由于长信号线的过度损耗以及有限的DC和AC电流承载能力，将传统的片上互连系统推向多GHz VLSI将很快遇到性能障碍。在片上互连中引入金属平面或网格为信号线提供了阻抗受控的环境，并且与较大的信号线相结合，可以解决长损耗线问题。平面还有助于以最小的AC/DC噪声分配电力。作为一个额外的功能，集成的无源元件到片上互连将是非常有用的实现一个完全集成的“系统在一个芯片上”。
Due to the excessive loss of long signal lines and limited DC and AC current carrying capacity, pushing the conventional on-chip interconnect system into multi-GHz VLSIs will soon hit performance barriers. Introduction of metal planes or meshes into on-chip interconnects provides an impedance-controlled environment for signal lines, and combined with larger signal lines, the long lossy line problem can be solved. Planes also help distribute power with minimal AC/DC noise. As an additional feature, integration of passive elements into on-chip interconnects will be very useful for realization of a fully integrated "system-on-a-chip".