Development and Application of Porous Vitrified-Bonded Wheel with Ultra-Fine Diamond Abrasives
Development and Application of Porous Vitrified-Bonded Wheel with Ultra-Fine Diamond Abrasives
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DOI:
10.4028/www.scientific.net/kem.257-258.251
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发表时间:
2004-01
期刊:
影响因子:
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通讯作者:
Takeshi Tanaka;S. Esaki;K. Nishida;T. Nakajima;K. Ueno
中科院分区:
文献类型:
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作者:
Takeshi Tanaka;S. Esaki;K. Nishida;T. Nakajima;K. Ueno
Both polishing and lapping processes have been employed in finishing semiconductors and ceramics in order to meet the demands for high surface quality, low cost, and large size. However, the machining processes involve unresolved problems concerning the safety of work environment and the cost of abrasive grains since a large quantity of abrasive grains is used. As a solution to the problems, the fixed abrasive wheel was proposed. We developed a porous vitrified-bonded wheel of ultra-fine diamond grains (0-1/8 m) as the first step for super-finishing of bearings. The elastic modulus of a vitrified-bond is approximately 4 times that of the resin bond. Although the diamond abrasive has ultra-high hardness and shows high efficiency in grinding, it is easily transformed into graphite during sintering. For this reason, we developed an easily melting bond by low temperature heating in order to prevent graphitization of diamond abrasives during sintering. Additionally, pores, which act as chip exhausts to allow grinding fluid flow easily, were fabricated by evaporating the pore forming mediums mixed in a vitrified-bonded diamond wheel. Grinding performances of the wheels were tested in super-finishing. Influences of different kinds of bonds, pore forming mediums, and sizes of abrasive grains, on grinding performance are discussed. We successfully obtained an ultra-fine finished surface on the bearing race with Ra at the nanometer scale.