Microstructure, residual stresses and mechanical properties of diffusion bonded tungsten-steel joint using a V/Cu composite barrier interlayer
Microstructure, residual stresses and mechanical properties of diffusion bonded tungsten-steel joint using a V/Cu composite barrier interlayer
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DOI：
10.1016/j.ijrmhm.2014.09.002
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发表时间：
2015-01-01
影响因子：
3.6
通讯作者：
Liu, Haoyang
中科院分区：
文献类型：
--
作者：
Cai, Qingshan;Liu, Wensheng;Liu, Haoyang
扩散接合是偏滤器应用中连接W和钢的优选方法。为了最大限度地减少由热膨胀系数的大失配引起的残余应力，并抑制脆性金属间化合物相的形成，V/Cu复合阻挡层的设计和检查，以产生W和钢之间的连接。在真空中在10 MPa压力下在1050 ℃下进行扩散接合1小时。金相分析表明，在所有的连接界面良好的结合。在结合区没有发现金属间化合物或其它脆性相。纳米压痕试验表明，扩散区的固溶强化效果明显。接头的强度高达402 MPa，由于残余应力集中，接头失效主要发生在W/V界面附近的W基体处。(C)2014爱思唯尔有限公司版权所有。
Diffusion bonding is a preferred method to join W and steel for divertor applications. To minimize the residual stress induced by the large mismatch of thermal expansion coefficients and to inhibit the formation of brittle intermetallic phases, a V/Cu composite barrier interlayer was designed and examined to produce a joint between W and steel. The diffusion bonding was carried out at 1050 degrees C for 1 h under a 10 MPa pressure in vacuum. Metallographic analysis revealed excellent bonding at all of the joining interfaces. Neither intermetallic compounds nor other brittle phases were found in the bonded region. Nano-indentation test across the joint interfaces demonstrated the effect of solid solution strengthening in the diffusion zone. The strength of the joint was as high as 402 MPa and the failure occurred predominantly at the W substrate near the W/V interface due to the residual stress concentration. (C) 2014 Elsevier Ltd. All rights reserved.