Enhanced pool boiling for electronics cooling using porous fin tops on open microchannels with FC-87
Enhanced pool boiling for electronics cooling using porous fin tops on open microchannels with FC-87
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DOI：
10.1016/j.applthermaleng.2015.08.043
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发表时间：
2015-12
影响因子：
6.4
通讯作者：
Arvind Jaikumar;S. Kandlikar
中科院分区：
文献类型：
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作者：
Arvind Jaikumar;S. Kandlikar
微电子的小型化趋势要求从高能量密度组件有效地散热。蒸汽室中的池沸腾是一种冷却技术，其使用相变直接从表面移除热量以有效地管理热传热需求。池沸腾的增强可以通过提供额外的成核位置和/或增加传热表面积来实现。本文以FC-87为工作流体，在开放微通道上设置多孔翅片顶部的强化铜表面。最大临界热通量（CHF）为37 W/cm 2，与普通芯片相比，CHF提高了270%。获得的高速图像表明，从多孔翅片顶部表面上的成核产生的单独的液体-蒸气路径是负责的增强。本文还研究了槽宽和槽深的内聚效应。
The miniaturization trend in microelectronics demands effective heat removal from the high energy density components. Pool boiling in vapor chambers is a cooling technique which uses phase change to remove heat directly from the surface to effectively manage the thermal heat transfer needs. The enhancement in pool boiling can be achieved by providing additional nucleation sites and/or increasing the heat transfer surface area. In this paper, an enhanced copper surface with porous fin tops on open micorchannels is used with FC-87 as the working fluid. A maximum Critical Heat Flux (CHF) of 37 W/cm2is achieved here which translates to a 270% enhancement in CHF compared to a plain chip. High speed images obtained suggest that separate liquid–vapor pathways generated from nucleation on the porous fin tops surface was responsible for the enhancement. The cohesive effect of channel width and channel depth is also studied here.