Behavior of joining interface between thin film metallic glass and silicon nitride at heating
Behavior of joining interface between thin film metallic glass and silicon nitride at heating
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DOI：
10.1016/j.mseb.2007.09.077
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发表时间：
2008-02
影响因子：
3.6
通讯作者：
S. Hata;Ryusuke Yamauchi;J. Sakurai;A. Shimokohbe
中科院分区：
文献类型：
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作者：
S. Hata;Ryusuke Yamauchi;J. Sakurai;A. Shimokohbe
