Bonding of glass microfluidic chips at room temperatures
Bonding of glass microfluidic chips at room temperatures
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DOI：
10.1021/ac0494477
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发表时间：
2004-09-15
影响因子：
7.4
通讯作者：
Fang, ZL
中科院分区：
文献类型：
--
作者：
Jia, ZJ;Fang, Q;Fang, ZL
提出了一种简单的室温键合工艺，用于玻璃微流控芯片的制作。在不需要洁净室设施、程序高温炉、加压水源、粘合剂或加压砝码的情况下，实现了高成品率（>95%）的高质量粘合。依次用丙酮、洗涤剂、高流速（10-20 m/s）自来水和无水乙醇预洗待粘合的板，并在浓硫酸中浸泡8-12 h。将板再次在高流速自来水中洗涤5分钟，最后用软化水洗涤。将清洁的表面在连续流动的软化水下紧密接触，并在室温下风干3 h以上。Mis键合工艺具有操作简单，板表面光滑度好，键合成品率高的特点。该程序可以很容易地应用于任何常规实验室。用剪切力试验方法测得的玻璃碎片的粘结强度高于6 kg/cm（2）。强结合强度的机制可能与将基材在酸或水中浸泡较长时间后在板表面上形成水解层有关。将上述方法制备的微流控芯片用于异硫氰酸荧光素标记氨基酸的毛细管电泳分离。
A simple, room-temperature bonding process was developed for the fabrication of glass microfluidic chips. Highquality bonding with high yields (>95%) was achieved without the requirement of clean room facilities, programmed high-temperature furnaces, pressurized water sources, adhesives, or pressurizing weights. The plates to be bonded were sequentially prewashed with acetone, detergent, high-flow-rate (10-20 m/s) tap water, and absolute ethyl alcohol and were soaked in concentrated sulfuric acid for 8-12 h. The plates were again washed in high-flow-rate tap water for 5 min and, finally, with demineralized water. The plates were bonded by bringing the cleaned surfaces into close contact under a continuous flow of demineralized water and air-dried at room temperature for more than 3 h.Mis bonding process features simple operation, good smoothness of the plate surface, and high bonding yield. The procedures can be readily applied in any routine laboratory. The bonding strength of glass chips thus produced, measured using a shear force testing procedure, was higher than 6 kg/cm(2). The mechanism for the strong bonding strength is presumably related to the formation of a hydrolyzed layer on the plate surfaces after soaking the substrates in acid or water for extended periods. Microfluidic chips bonded by the above procedure were tested in the CE separation of fluorescein isothiocyanate-labeled amino acids.