Microstructural formation and mechanical performance of friction stir double-riveting welded Al-Cu joints
Microstructural formation and mechanical performance of friction stir double-riveting welded Al-Cu joints
复制标题
搅拌摩擦双铆焊Al-Cu接头的组织形成及力学性能
DOI：
10.1016/j.cja.2022.11.010
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发表时间：
2022-11
影响因子：
5.7
通讯作者：
Yewei Zhang
中科院分区：
文献类型：
--
作者：
Shude Ji;Zhiqing Zhang;Peng Gong;Hua Liu;Xiao Cui;Yewei Zhang
为了实现铝/铜双金属板的高质量连接，提出了一种新型搅拌摩擦双铆接焊接技术，该技术采用铜柱作为铆钉，采用特殊设计的大凹角凸肩焊接工具。研究了不同旋转速度和停留时间下Al/Cu FSDRW接头的成形、界面特性、力学性能和断裂特征。结果表明，成功地获得了成形良好的FSDRW接头。圆柱形铜柱被改造成双铆头结构，顶部有铜锚，底部有铝锚，从而提供了出色的机械互锁。由于Cu柱和Cu板之间充分的冶金结合，在搭接界面处形成了无缺陷的Cu/Cu界面，从而有效地抑制了裂纹从Al和Cu板之间的搭接界面处的金属间化合物层扩展。接头的拉剪载荷随旋转速度和焊接停留时间的增加先增大后减小，最大值为5.52 kN。FSDRW接头呈现韧性断裂和脆性断裂的混合模式。
A novel friction stir double-riveting welding (FSDRW) technology was proposed in order to realize the high-quality joining of upper aluminum (Al) and lower copper (Cu) plates, and this technology employed a Cu column as a rivet and a specially designed welding tool with a large concave-angle shoulder. The formations, interfacial characteristics, mechanical properties and fracture features of Al/Cu FSDRW joints under different rotational velocities and dwell times were investigated. The results showed that the well-formed FSDRW joint was successfully obtained. The cylindrical Cu column was transformed into a double riveting heads structure with a Cu anchor at the top and an Al anchor at the bottom, thereby providing an excellent mechanical interlocking. The defect-free Cu/Cu interface was formed at the lap interface due to the sufficient metallurgical bonding between the Cu column and the Cu plate, thereby effectively inhibiting the propagation of crack from the intermetallic compound layer at the lap interface between the Al and Cu plates. The tensile shear load of joint was increased first and then decreased when the rotational velocity and dwell time of welding tool increased, and the maximum value was 5.52 kN. The FSDRW joint presented a mixed mode of ductile and brittle fractures.
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影响因子：
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通讯作者：
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DOI：
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DOI：
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发表时间：
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期刊：
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