Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions
Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions
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DOI：
10.1016/j.electacta.2004.08.045
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发表时间：
2005-03
影响因子：
6.6
通讯作者：
Nisit Tantavichet;M. Pritzker
中科院分区：
文献类型：
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作者：
Nisit Tantavichet;M. Pritzker
研究了电镀方式、氯化物和硫脲对铜镀层形貌的影响。所有实验均在以500 rpm旋转的圆盘电极上进行，平均电流密度为4Adm-2，以产生10μm厚的沉积物。在无添加剂的溶液中，脉冲电流（PC）的使用改善了存款形态和亮度比直流电镀。在硫脲（无Cl−）存在下，DC和PC电镀获得的沉积物在大多数电镀条件下相似。硫脲的存在通常改善存款质量比在无添加剂的解决方案中获得的，但导致微观结节的形成和存款出现轻微浑浊，导致较低的反射率比抛光的未涂覆的铜表面。在含硫脲溶液中加入Cl-会强烈影响存款形态，这取决于氯化物浓度和脉冲条件。它阻止了结核的形成，并产生了显微镜下明亮和反光的沉积物，但造成了极端的宏观粗糙度。然而，在含有适量硫脲和Cl−的溶液中以50 Hz进行PC电镀，发现产生宏观和微观上光滑的沉积物，其反射率与抛光的未涂覆铜基材的反射率相似。
The influence of plating mode, chloride and thiourea (TU) on morphology of copper deposits has been studied. All experiments were conducted on disc electrodes rotating at 500rpm and an average current density of 4Adm−2to produce 10μm thick deposits. In additive-free solutions, the use of pulsed current (PC) improved deposit morphology and brightness over DC plating. In the presence of thiourea (no Cl−), the deposits obtained by DC and PC plating were similar under most plating conditions. The presence of thiourea generally improved deposit quality over that obtained in additive-free solutions, but caused the formation of microscopic nodules and the deposits to appear slightly cloudy, resulting in lower reflectances than that of a polished uncoated copper surface. The addition of Cl−to thiourea-containing solutions strongly influenced deposit morphology at both microscopic and macroscopic scales depending on chloride concentration and pulse conditions. It prevented nodule formation and created microscopically bright and reflective deposits, but caused extreme macroscopic roughness. Nevertheless, PC plating at 50Hz in solutions containing appropriate amounts of thiourea and Cl−was found to yield macroscopically and microscopically smooth deposits with reflectance similar to that of a polished uncoated copper substrate.