Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates
Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates
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DOI：
10.1016/j.intermet.2011.08.014
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发表时间：
2012-01-01
期刊：
影响因子：
4.4
通讯作者：
Hadley, Peter
中科院分区：
文献类型：
--
作者：
Etschmaier, Harald;Novak, Jiri;Hadley, Peter
研究了以共晶金-锡合金为钎料在铜和银基体上等温扩散焊接时金属间相演变的动力学和形貌。通过原位x射线衍射可以确定所涉及的相以及金属间层生长速率和活化能等反应参数。透射电子显微镜和能量色散x射线光谱学可以进一步了解在此过程中发生的形态变化。结果有助于更好地理解这种先进的连接方法广泛应用于半导体封装。(C) 2011 Elsevier Ltd.版权所有。
The dynamics and the morphology of the intermetallic phase evolution for isothermal diffusion soldering with the eutectic Au-Sn alloy as the solder material on copper and silver substrates was investigated. The phases involved and the reaction parameters like the rate of the intermetallic layer growth and the activation energy could be determined by in-situ X-ray diffraction. Transmission electron microscopy and energy dispersive X-ray spectroscopy bring further insight into the morphology changes that occur during the process. The results contribute to a better understanding of this advanced joining method extensively used in semiconductor packaging. (C) 2011 Elsevier Ltd. All rights reserved.