Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives
Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives
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DOI：
10.1007/s11664-005-0212-4
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发表时间：
2005-03
影响因子：
2.1
通讯作者：
Yi Li;K. Moon;C. Wong
中科院分区：
文献类型：
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作者：
Yi Li;K. Moon;C. Wong
为了改善各向异性导电胶（ACA）接头的电学性能，在金属填料与基板焊盘之间的界面引入了自组装单层（SAM）化合物。通过测量具有亲水性或疏水性尾部基团的SAM化合物（例如十八烷基硫醇（ODT）、巯基乙酸（MAA）和1，4-苯二硫酚（二硫酚））在金表面的接触角，研究了金上SAM的形成和热稳定性。在Au表面。使用具有两种不同固化温度的环氧树脂作为ACA制剂的聚合物基质。SAM处理过的ACA接头在相同的外加电流下比未处理过的接头电阻低得多，并且对低固化温度的环氧树脂基体的影响更显著。
To improve the electrical property of the anisotropic conductive adhesive (ACA) joints, self-assembled monolayer (SAM) compounds are introduced into the interface between the metal filler and the substrate bond pad. The formation of the SAM on gold and the thermal stability were investigated by measuring the contact angles of SAM compounds with a hydrophilic or hydrophobic tail groups such as octadecanethiol (ODT), mercpatoacetic acid (MAA), and 1,4-benzenedithiol (dithiol) on the Au surface. Epoxy resins with two different curing temperatures were used as polymer matrices of the ACA formulations. The SAM-treated ACA joints showed much lower resistance at the same applied current than nontreated joints, and the effect on the low curing temperature epoxy matrices was more significant.