Laser drilling of blind holes in FR4/glass

Laser drilling of blind holes in FR4/glass
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在 FR4/玻璃上激光钻孔盲孔

DOI:
10.1108/030561201998000008
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发表时间:
1998
期刊:
影响因子:
0.9
通讯作者:
J. V. Puymbroeck
J. V. Puymbroeck
中科院分区:
工程技术4区
文献类型:
--
作者:
Mark D. Owen;E. Roelants;J. V. Puymbroeck

文献摘要

被引文献

相似文献

在过去的两年中,激光钻孔微通孔已成为生产小于150 mm盲孔的主要方法,全球安装了100多台激光钻孔机,配备各种激光类型。这些系统中只有少数能够在标准玻璃增强FR 4中钻盲孔。详细介绍了位于德国卡尔斯鲁厄的西门子AUT LP生产线,包括成功评估、引进和全面生产FR 4/玻璃的激光钻孔。对于薄材料中的所有铜结构化和直径小于150 mm的所有微孔,选择具有在355 nm下工作的紫外Nd:YAG激光器的ESI 5100,并且对于需要至少250 mm孔的较厚结构,选择TEA CO2激光器。自1996年11月以来一直在生产。详细介绍了工艺改进、设计规则、合格材料、可靠性测试和生产经验。
In the last two years, laser drilled microvias have become the dominant method for producing blind vias smaller than 150 mm, with over 100 laser drilling machines with a variety of laser types installed worldwide. Only a few of these systems have been qualified for drilling blind holes in standard glass reinforced FR4. Details a production line at Siemens AUT LP in Karlsruhe, Germany, involving the successful evaluation, introduction, and full production of laser drilling of FR4/glass. An ESI 5100 with Ultraviolet Nd:YAG laser operating at 355nm was chosen for all copper structuring and all microvias less than 150 mm in diameter in thin materials, and a TEA CO2 laser was chosen for thicker constructions, where at least 250 mm holes were required. Production has been running since November 1996. Details the process modifications, design rules, qualified materials, reliability tests, and production experiences.