Transient Liquid Phase Bonding
Transient Liquid Phase Bonding
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DOI：
10.1002/9783527813964.ch12
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发表时间：
2019-03
期刊：
影响因子：
--
通讯作者：
Tariq Islam;A. Sharif
中科院分区：
文献类型：
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作者：
Tariq Islam;A. Sharif
“瞬时液相”键合，也称为“TLP键合”，是一种连接工艺;相对较新的工艺，现在广泛应用于许多应用中，它使用中间层作为连接介质。起源于古代，工艺可以追溯到十六世纪，并延伸到现代的加入。这种接合工艺消除了诸如表面氧化、高残余应力和易受影响的材料中的损坏等问题，并提高了接头的机械、热、电和抗蠕变/疲劳性能。整个中间层或部分中间层在加热过程中熔化，并且中间层元素反应并扩散到基底材料中。结果，发生等温凝固。最后，冷却后，由于金属间化合物（IMC）的形成，产生了熔点高于基体或伴随材料的结合。它通常在低于N3002或Ar）C的气氛下进行。该下和过程中的温度施加的属性条件下是看不见的比（真空450干净的300 ℃或和接头在一个最惰性的更高的强度和获得类似的性能像基体金属。TLP焊接可应用于各种连接操作，包括批量连接和微连接。在微连接应用中，该工艺范围从微致动器到微致动器。
“Transient liquid phase” bonding, also known as “TLP bonding,” is a joining process; comparatively a new one and now widely used in numerous applications, it uses an interlayer as a joining medium. Originated in ancient times, the process can be traced back to the sixteenth century and stretched to modern times for joining. This bonding process removes problems such as surface oxidation, high residual stresses, and damage in materials which are susceptible, and increases mechanical, thermal, electrical, and creep/fatigue resistance properties of the joint. The whole interlayer or a part of the interlayer melts during the heating process and the interlayer element reacts and diffuses into the substrate materials. As a result, isothermal solidification happens. Finally, upon cooling, a bond that has a higher melting point than the base or accompanying material is created due to the formation of the intermetallic compound (IMC). It is normally carried atmosphere cases lower than like N 300 2 or∘ out Ar) C. The under and process at an temperatures imposed attributes condition lower are invisible than (vacuum 450 clean∘ C or and joints in an in most inert with higher strengths and getting similar properties like base metal. TLP bonding can be applied to a wide range of joining operations including bulk and microjoining. In microjoining applications, the process ranges from microactuators in