Microstructure and mechanical properties of an Si3N4/Si3N4 joint brazed with Au–Ni–Pd–V filler alloy
Microstructure and mechanical properties of an Si3N4/Si3N4 joint brazed with Au–Ni–Pd–V filler alloy
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DOI：
10.1016/j.scriptamat.2010.11.004
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发表时间：
2011-03
影响因子：
6
通讯作者：
Yue Sun;Junzheng Zhang;Y. Geng;K. Ikeuchi;T. Shibayanagi
中科院分区：
文献类型：
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作者：
Yue Sun;Junzheng Zhang;Y. Geng;K. Ikeuchi;T. Shibayanagi
采用Au-Ni-Pd-V钎料在1423 K下钎焊Si 3 N4陶瓷60 min。采用扫描电镜、透射电镜和三点弯曲试验对接头的显微组织和力学性能进行了研究。结果表明，在Si 3 N4陶瓷/钎料合金界面处形成了VN反应层。接头中心部分由Au[Ni，Pd]和Ni[Si，V]固溶体组成。接头的室温强度为264.4MPa，在1073 K时达到214.2MPa。
Si3N4ceramics were brazed using Au–Ni–Pd–V filler alloy at 1423K for 60min. The microstructure and mechanical properties of the joints were investigated by scanning and transmission electron microscopy and a three-point bending test. The results indicate that a VN reaction layer was formed at the Si3N4ceramic/filler alloy interface. The central part of the joint was composed of Au[Ni,Pd] and Ni[Si,V] solid solution. The room-temperature strength of the joint was 264.4MPa, and 214.2MPa was achieved when the joints were tested at 1073K.