Debris from tape-target irradiated with pulsed YAG laser
Debris from tape-target irradiated with pulsed YAG laser
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DOI：
10.1016/s0169-4332(02)00369-0
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发表时间：
2002-09
影响因子：
6.7
通讯作者：
H. Azuma;Y. Nishimura;Sakata Atsushi;A. Takeuchi
中科院分区：
文献类型：
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作者：
H. Azuma;Y. Nishimura;Sakata Atsushi;A. Takeuchi
针对高亮度、无碎片的激光等离子体极紫外光源，测量了极紫外光谱和碎片。用脉冲YAG激光（SHG，E=0.8J，t=7ns）照射带靶20多万次，测量了碎片散射角分布和碎片堆积量。用扫描电镜观察磨屑的形态和大小。采用掠入射XUV光谱仪，结合镀Au超环面镜、衍射光栅和X射线CCD相机，获得了极紫外光谱。在200，000次激光轰击中，铜带靶在偏离靶法线50°处产生了50nm厚的碎片，在偏离靶法线70°以上产生了30nm厚的碎片。观察到直径大于20μm的铝碎片和直径小于1μm的铜碎片。研制了一种具有低碎片的金属和聚合物薄膜带靶、碎片屏蔽和无碎片EUV滤光片的激光等离子体EUV光源系统。我们展示了连续8小时产生的EUV与开发的激光产生等离子体EUV源系统的EUV光刻。
For high brightness and debris-free laser-produced plasma EUV source, EUV spectra and debris were measured. The experimental debris scattering angle distribution and the amount of piled debris were estimated in the thickness of debris on silicon wafers from tape-target irradiated with pulsed YAG laser (SHG, E=0.8J, t=7ns) in more than 200,000 laser shots. The shape and size of debris were observed using scanning electron microscope. EUV spectra were obtained by using the grazing-incidence XUV spectrometer with the Au-coated toroidal mirror, diffraction grating and X-ray CCD camera. In 200,000 laser shots, for copper tape-target, 50nm thick debris at 50° from target normal and 30nm thick debris at more than 70° from target normal were obtained. More than 20μm in diameter debris of aluminum and less than 1μm in diameter debris of copper were observed. Laser-produced plasma EUV source system with low debris tape-target of thin metal and polymer films, debris-shield and debris-free EUV filter has been developed. We demonstrated successive 8h generation of EUV with the developed laser-produced plasma EUV source system for EUV lithography.