Role of 2-thiouracil as addition agent during the electrodeposition of copper on the copper (III) plane
Role of 2-thiouracil as addition agent during the electrodeposition of copper on the copper (III) plane
复制标题
2-硫氧嘧啶作为加成剂在铜（III）面上电沉积铜过程中的作用
DOI：
10.1007/bf01084141
复制
发表时间：
1987
期刊：
影响因子：
--
通讯作者：
S. Nageswar
中科院分区：
文献类型：
--
作者：
R. Sarma;S. Nageswar
已经提出了许多用于电沉积铜的添加剂，以便在沉积性质上产生所需的效果。一些研究人员[1-4]对铜在单晶衬底上的电沉积进行了研究，目的是获得关于这些添加剂作用机理的信息。对沉积过程中形成的化学物种的鉴定也有助于揭示添加剂在沉积过程中的作用。本文研究了酸性硫酸盐溶液在铜(III)晶面上电沉积铜时，2-硫氧嘧啶的控制量对表面形貌的影响。测量了沉积过程中的过电位，并将计算的电极动力学参数与沉积过程中的形态变化进行了关联。从观察结果中解释了2-硫氧嘧啶作为加成剂的作用。积水到10摄氏度厘米-2。在每个电流密度下，对每个不同的浓度使用新鲜的晶体。使用真空管电压计(飞利浦GM 90)，以新制备的铜电极为参照，记录了沉积过程中的阴极过电位，其精度为+5 mV。在沉淀池中使用拉丁毛细管可将任何欧姆过电势贡献降至最低。通过采用搅拌和不搅拌时过电位值的差异对浓差极化进行校正，在放大倍数为x625的相差显微镜下检查干燥表面的形态，并拍摄显微照片(在这里以x600复制)。每个实验都重复进行，以确保表面形态特征和过电位值的重复性。
Many addition agents have been proposed for the electrodeposition of copper in order to produce desired effects in the nature of the deposit. A few investigators [1-4] have carried out studies on the electrodeposition of copper on copper single-crystal substrates with the object of obtaining information on the mechanism of the action of these addition agents. Identification of the chemical species formed during the deposition also throws light on the role of the addition agent during the deposition process. In the present work the effect of controlled amounts of 2-thiouracil on the surface topography during the electrodeposition of copper on the copper (III) plane from an acid sulphate bath has been investigated. The overpotentials during the deposition process were measured in all the cases and the calculated electrode kinetic parameters were correlated with the morphological changes. The role of 2-thiouracil as an addition agent has been explained from the observed results. ponding to 10 C cm-2. A fresh crystal was used for each distinct concentration at every current density. The cathodic overpotential during the deposition process was noted with reference to a freshly prepared copper electrode at various time intervals of deposition using a vacuum tube voltmeter (Philips GM 90) with an accuracy of+ 5 mV. The use of a Luggin capillary in the deposition cell minimized any ohmic overpotential contribution. A correction for the concentration polarization was incorporated by taking the difference in the values of the overpotential with and without stirring, The morphology of the dried surface was examined under a phase contrast microscope at a magnification of x 625 and photomicrographs were taken (reproduced here'at x 600). Each experiment was repeated to ensure reproducibility in the surface morphological features and overpotential values.