Device Modelling for Bendable Piezoelectric FET-Based Touch Sensing System
Device Modelling for Bendable Piezoelectric FET-Based Touch Sensing System
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DOI：
10.1109/tcsi.2016.2615108
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发表时间：
2016-12-01
影响因子：
5.1
通讯作者：
Dahiya, Ravinder
中科院分区：
文献类型：
--
作者：
Gupta, Shoubhik;Heidari, Hadi;Dahiya, Ravinder
柔性电子学正迅速向器件和电路发展，以实现许多新的应用。在响应速度、一致性和可靠性方面，高性能仍然是一个症结。高性能相关挑战的潜在解决方案将我们带回久经考验的硅基电子产品。然而，硅基器件由于弯曲相关应力的响应变化是一个令人担忧的问题，特别是因为没有合适的模型来预测这种行为。这也使得电路设计成为一项艰巨的任务。本文通过对基于可弯曲压电氧化物半导体场效应晶体管(POSFET)的触摸传感器的研究，报道了这方面的研究进展。建立了POSFET的解析模型，补充了VerilogA模型，描述了平面和应力条件下器件在法向力作用下的行为。此外，还对POSFET器件的动态读出电路补偿进行了分析和比较，以减小在拉应力和压应力下的压阻效应。这种方法引入了对设备响应中的应力引起的变化进行系统建模的第一步。这项系统的研究将有助于实现高性能的可弯曲微系统，在各种应用中需要的超薄芯片(UTC)上集成传感器和读出电路，特别是电子皮肤(e-Skin)。
Flexible electronics is rapidly evolving towards devices and circuits to enable numerous new applications. The high-performance, in terms of response speed, uniformity and reliability, remains a sticking point. The potential solutions for high-performance related challenges bring us back to the time-tested silicon based electronics. However, the changes in the response of silicon based devices due to bending related stresses is a concern, especially because there are no suitable models to predict this behavior. This also makes the circuit design a difficult task. This paper reports advances in this direction, through our research on bendable piezoelectric oxide semiconductor field effect transistor (POSFET) based touch sensors. The analytical model of POSFET, complimented with VerilogA model, is presented to describe the device behavior under normal force in planar and stressed conditions. Further, dynamic readout circuit compensation of POSFET devices have been analyzed and compared with similar arrangement to reduce the piezoresistive effect under tensile and compressive stresses. This approach introduces a first step towards the systematic modeling of stress induced changes in device response. This systematic study will help realize high-performance bendable microsystems with integrated sensors and readout circuitry on ultra-thin chips (UTCs) needed in various applications, in particular, the electronic skin (e-skin).