Effect of Substrate Material on Fatigue Crack Propagation Rate of Adhesively Bonded DCB Joints
Effect of Substrate Material on Fatigue Crack Propagation Rate of Adhesively Bonded DCB Joints
复制标题
基材材料对粘接 DCB 接头疲劳裂纹扩展速率的影响
DOI：
10.1163/016942410x537369
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发表时间：
2011
影响因子：
2.3
通讯作者：
K. Ishii
中科院分区：
文献类型：
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作者：
K. Ishii
采用碳纤维布和铝基材粘接的DCB试件，研究了基材材料对疲劳裂纹扩展速率的影响。试验结果表明，随着粘结层厚度的增加，疲劳门槛值ΔGth降低，裂纹扩展参数n增大，且铝接头的裂纹扩展参数n小于碳纤维接头。为了阐明疲劳裂纹扩展行为，进行了断口观察和有限元分析。此外，将Gurson模型应用于粘结层。扫描电子显微镜照片显示，含铝基材的接头断口表面形成大量空洞，而含碳纤维基材的接头则抑制了孔洞的生长。有限元分析结果还表明，铝基接头的孔洞面积分数大于碳纤维基材接头。因此，上述空洞的实验和数值趋势与疲劳裂纹扩展行为的趋势相一致。
The effect of substrate material on the fatigue crack propagation rate was investigated using adhesively bonded DCB specimens with CFRP and aluminum substrates. The experimental results show that the increase in thickness of the adherend lowers the fatigue threshold, ΔG th, and raises the crack growth parameter, n, irrespective of the substrate material, and that the crack growth parameter, n, for the aluminum joints is less than that for the CFRP joints. To elucidate the fatigue crack propagation behavior, fracture surface observation and finite element analysis have been conducted. Besides, Gurson's model is applied to the adhesive layer. SEM images show that numerous voids are formed in the fracture surface for the joints with aluminum substrate, but the growth of voids is suppressed for the joints with CFRP substrate. FEM results also show that the void area fraction for the joint with aluminum substrate is greater than that with CFRP substrate. Thus, the above experimental and numerical trends of voids correspond to the trends of the fatigue crack propagation behavior.