Fabrication of high-density wiring interposer for 10 GHz 3D packaging using a photosensitive multiblock copolymerized polyimide
Fabrication of high-density wiring interposer for 10 GHz 3D packaging using a photosensitive multiblock copolymerized polyimide
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DOI：
10.1143/jjap.43.4141
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发表时间：
2004-07-01
期刊：
影响因子：
--
通讯作者：
Aoyagi, M
中科院分区：
文献类型：
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作者：
Kikuchi, K;Segawa, S;Aoyagi, M
我们已经开发了一种高密度布线插入器10 GHz的3D封装使用光敏多嵌段共聚聚酰亚胺。这种新型聚酰亚胺不需要高温热固化，可以实现微米级的精细图案而不会产生图案收缩。该聚酰亚胺具有良好的电性能，如高击穿电压和低介电常数。因此，认为通过引入该光敏聚酰亚胺作为中介层的绝缘体，可以实现用于LSI封装的高性能中介层。我们通过实验证实了高密度布线中介层可以使用聚酰亚胺和金来制造。我们优化了光敏聚酰亚胺薄膜的基本性能，用于制造中介层。精细的金属布线被聚酰亚胺平滑地覆盖，如通过所制造的平衡对带状线结构的横截面的扫描电子显微镜（SEM）所证实的。根据时域反射计（TDR）测量，确定带状线的特性阻抗在内插器芯片的中心处在55.2 Ω +/-11.5%内。
We have developed a high-density wiring interposer for 10GHz 3D packaging using a photosensitive multiblock copolymerized polyimide. This new polyimide can realize micron-sized fine patterns without pattern shrinkage because of the nonrequirement of high-temperature thermal curing. The polyimide has good electric properties such as high breakdown voltage and low dielectric constant. Therefore, it is considered that by introducing this photosensitive polyimide as an insulator of the interposer, a high-performance interposer for LSI packaging can be realized. We confirmed experimentally that the high-density wiring interposer can be fabricated using the polyimide and gold. We optimized the basic properties of the photosensitive polyimide film for the fabrication of the interposer. Fine metal wirings were smoothly covered by the polyimide, as confirmed by scanning electron microscopy (SEM) of the cross section of the fabricated balance pair strip line structure. From the time domain reflectometry (TDR) measurement, it was determined that the characteristic impedance of the strip line is within 55.2Omega +/- 11.5% at the center of the interposer chip.