Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles
Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles
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DOI：
10.1007/s13391-013-3148-5
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发表时间：
2014-01
影响因子：
2.4
通讯作者：
Z. Pešina;Vít Vykoukal;M. Palcut;J. Sopoušek
中科院分区：
文献类型：
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作者：
Z. Pešina;Vít Vykoukal;M. Palcut;J. Sopoušek
在这项工作中，研究了通过低温烧结银纳米颗粒浆料制备的铜-铜接头样品的机械性能。银纳米膏是通过有机金属前体的受控热分解来制备的。合成的Ag颗粒呈球形，平均直径为8.5 nm。 Cu-to-Cu 接头样品是通过在两块抛光铜板之间放置少量银纳米膏并在空气中于 150°C、200°C、220°C 和 350°C 下烧结而制成的。施加正常负载以帮助烧结。通过在样品粘合区域施加均匀的应力并测量相应的应变来测量机械性能。研究发现施加外部载荷对材料的机械性能有积极影响。此外，观察到了有趣的高剪切强度值。
In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150°C, 200°C, 220°C and 350°C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed.