Extraction of impacts of fabrication spread and thermal noise on operation of superconducting digital circuits
Extraction of impacts of fabrication spread and thermal noise on operation of superconducting digital circuits
复制标题
提取制造扩散和热噪声对超导数字电路运行的影响
DOI：
10.1109/77.783912
复制
发表时间：
1999
影响因子：
1.8
通讯作者：
Wei Chao
中科院分区：
文献类型：
--
作者：
Vasili K. Semenov;Y. Polyakov;Wei Chao
我们开发了一种程序来研究和区分 RSFQ 电路的几种干扰影响，例如热噪声、通量捕获和制造扩展。该过程应用于稍微修改的 RSFQ 移位寄存器，具有 3 个独立的直流偏置，这对于所有单元都是通用的。其中一个偏见发挥着特殊的作用。名义上它等于零，仅用于对电路的操作产生可控效果。不同因素的影响是从它们对特殊偏差的干扰中提取出来的。研究发现，即使在低 (/spl sim/4 K) 工作温度下，HYPRES, Inc. 制造的最佳样品中热噪声的影响也与制造扩散的影响相当。
We have developed a procedure to investigate and distinguish several disturbing influences on an RSFQ circuit such as thermal noise, flux trapping and fabrication spread. The procedure is applied to a slightly modified RSFQ shift register with 3 independent dc biases, which are common for all cells. One of the biases performs a special function. Nominally it is equal to zero and used only to create a controllable effect on the operation of the circuit. The impact of different factors is extracted from their interference with the special bias. It has been found that the influence of thermal noise in the best samples fabricated at HYPRES, Inc. is comparable with that of fabrication spread even for low (/spl sim/4 K) operational temperature.