Nucleation of interfacial shear cracks in thin films on disordered substrates
Nucleation of interfacial shear cracks in thin films on disordered substrates
复制标题
无序基底上薄膜中界面剪切裂纹的成核
DOI：
10.1088/1742-5468/2009/02/p02047
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发表时间：
2008
期刊：
影响因子：
--
通讯作者：
E. Aifantis
中科院分区：
文献类型：
--
作者：
M. Zaiser;P. Moretti;A. Konstantinidis;E. Aifantis
我们制定了一个理论模型的剪切破坏的薄膜拴在一个刚性基板。膜与基底之间的界面被建模为具有随机波动的剪切强度/断裂能的内聚层。我们表明，在尺度大的膜厚度相比，内部剪切应力作用在界面上可以近似为二阶梯度的剪切位移跨界面。该模型被用来研究一维剪切裂纹，我们评估的应力依赖的临界裂纹的成核概率。这是用来确定界面的剪切强度作为膜的几何形状和界面的统计特性的函数。
We formulate a theoretical model of the shear failure of a thin film tethered to a rigid substrate. The interface between film and substrate is modeled as a cohesive layer with randomly fluctuating shear strength/fracture energy. We demonstrate that, on scales large compared with the film thickness, the internal shear stresses acting on the interface can be approximated by a second-order gradient of the shear displacement across the interface. The model is used to study one-dimensional shear cracks, for which we evaluate the stress-dependent probability of nucleation of a critical crack. This is used to determine the interfacial shear strength as a function of the film geometry and statistical properties of the interface.