Effects of soil structure on thermal softening of yield stress
Effects of soil structure on thermal softening of yield stress
复制标题
土结构对屈服应力热软化的影响
DOI：
10.1016/j.enggeo.2020.105544
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发表时间：
2020-05
影响因子：
7.4
通讯作者：
Tang C. S.
中科院分区：
文献类型：
--
作者：
Cheng Q.;Zhou C.;Ng C. W. W.;Tang C. S.
热软化通常指屈服应力随温度升高而降低。以往的热软化实验研究集中在单一类型的标本（无论是完整的或重新压实）。本文通过温控等向压缩试验，研究了饱和原状、重塑和重塑黄土试样的热软化特性。还进行了扫描电子显微镜（SEM）测量，以评估这些试样的微观结构。当土壤温度从5 ℃升高到50 ℃时，原状土样、重塑土样和重塑土样的屈服应力分别降低了33%、46%和51%。完整试样的最大抵抗热软化的结构主要是因为它的颗粒间的接触是由粘土骨料稳定的，如由SEM结果所证明的。重塑试样具有最小的抵抗热软化的结构，主要是因为重塑试样中的粘土颗粒漂浮在粉土颗粒的表面上，而不是在颗粒间的接触。
Thermal softening is generally referred as the reduction of yield stress with increasing temperature. Previous experimental studies of thermal softening focus on a single type of specimen (either intact or recompacted). In this study, thermal softening of saturated intact, recompacted and reconstituted loess specimens was investigated through temperature-controlled isotropic compression tests. Scanning electron microscope (SEM) measurements were also carried out to evaluate the microstructures of these specimens. It is found when soil temperature increases from 5 to 50 degrees C, the yield stresses of the intact, recompacted and reconstituted specimens decreased by about 33%, 46% and 51%, respectively. The most resistant structure of intact specimen to thermal softening is mainly because its inter-particle contacts are stabilized by clay aggregates, as evident by SEM results. Reconstituted specimen has the least resistant structure to thermal softening, mainly because clay particles in reconstituted specimen float on the surface of silt particles rather than at inter-particle contacts.
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影响因子：
3.6
作者：
Ng, Charles Wang Wai;Sadeghi, Hamed;Baghbanrezvan, Sina
通讯作者：
Baghbanrezvan, Sina
DOI：
10.1680/jgeot.16.p.293
发表时间：
2019-01
期刊：
Géotechnique
影响因子：
--
作者：
Charles Wang Wai Ng;Qingyi Mu;Chao Zhou
通讯作者：
Charles Wang Wai Ng;Qingyi Mu;Chao Zhou
影响因子：
3.6
作者：
H. Abuel-Naga;D. Bergado;A. Bouazza;G. Ramana
通讯作者：
H. Abuel-Naga;D. Bergado;A. Bouazza;G. Ramana
影响因子：
--
作者：
W. Busscher
通讯作者：
W. Busscher
影响因子：
5.8
作者：
A. Maatouk;S. Leroueil;P. Rochelle
通讯作者：
A. Maatouk;S. Leroueil;P. Rochelle