MEMS post-packaging by localized heating and bonding
MEMS post-packaging by localized heating and bonding
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DOI：
10.1109/6040.883749
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发表时间：
2000-11-01
影响因子：
--
通讯作者：
Lin, LW
中科院分区：
文献类型：
--
作者：
Lin, LW
This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging filed of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field but also speeds up the product commercialization cycle. A review of engineering bases describing current technologies of MEMS packaging and wafer bonding is followed by an innovative post-packaging approach by localized heating and bonding. Process demonstrations by selective encapsulation are presented, including an integrated low pressure chemical vapor deposition (LPCVD) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.
