Direct bonding of gold on flexible substrates
Direct bonding of gold on flexible substrates
复制标题
金直接键合在柔性基材上
DOI：
10.1038/s41928-022-00716-y
复制
发表时间：
2022
影响因子：
34.3
通讯作者：
Parker Matthew
中科院分区：
文献类型：
--
作者：
Yuki Satake;Hiroyuki Ishii;Parker Matthew
柔性电子器件的性能可以与由刚性材料制成的器件竞争。然而，将多个柔性设备组合成一个更大、更复杂的系统需要将设备与导电的东西互连，这带来了一些挑战。具有高固化温度的焊料或粘合剂可能会损坏元件，而低温方法，如表面活化粘合，需要具有平坦和清洁表面的金属层，这在软基板上难以实现。Kenjiro Fukuda、Shinjiro Umezu、Takao Someya和同事们开发了一种水蒸气等离子体辅助键合方法，用于将沉积在薄聚合物层上的金电极直接键合。早稻田大学、理化学研究所和东京大学的研究人员将金层暴露在水蒸气等离子体中，然后将它们在环境压力和温度下直接接触几个小时。该技术适用于光滑和粗糙的金膜，包括典型的粗糙度的金蒸发在柔性基板上。结合的电极在10，000次弯曲循环后表现出小于1%的接触电阻变化，并且在10，000次压缩和松弛循环后表现出23%的变化。
The performance of flexible electronic devices can be competitive with devices made from rigid materials. However, combining several flexible devices into a larger and more complex system requires interconnecting the devices with something conductive, which creates several challenges. Solder or adhesives with high curing temperatures can damage the components, and low-temperature methods, such as surface-activated bonding, require metal layers with flat and clean surfaces, which are difficult to achieve on soft substrates. Kenjiro Fukuda, Shinjiro Umezu, Takao Someya and colleagues have now developed a water-vapour-plasma-assisted bonding method for directly bonding gold electrodes deposited on thin polymer layers.The researchers—who are based at Waseda University, RIKEN and the University of Tokyo—exposed the gold layers to water vapour plasma and then placed them in direct contact with each other for several hours at ambient pressure and temperature. The technique works on smooth and rough gold films, including the typical roughness of gold evaporated on ultrathin flexible substrates. The bonded electrodes exhibit a change in contact resistance of less than 1% after 10,000 bending cycles, and a change of 23% after 10,000 compression and relaxation cycles.