FLAW: FPGA lifetime awareness
FLAW: FPGA lifetime awareness
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缺陷：FPGA 寿命意识
DOI：
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发表时间：
2006
期刊：
影响因子：
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通讯作者：
K. Sarpatwari
中科院分区：
文献类型：
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作者：
S. Srinivasan;P. Mangalagiri;Yuan Xie;N. Vijaykrishnan;K. Sarpatwari
技术的大规模扩展对超大规模集成电路的可靠性有不利影响。除了增加瞬态误差敏感性外，由于不同的物理现象，电路也变得更容易受到永久损坏和失效。这种担忧最近在常规微架构中得到了证实。在这项工作中，我们展示了现场可编程门阵列（FPGA）对两种不同类型的硬错误的脆弱性，即时间相关介电击穿（TDDB）和电迁移。我们还分析了由热载子效应（HCE）引起的fpga性能随时间的退化。我们还提出了三种新技术来对抗这种基于老化的故障并增加设备的使用寿命
Aggressive scaling of technology has an adverse impact on the reliability of VLSI circuits. Apart from increasing transient error susceptibility, the circuits also become more vulnerable to permanent damage and failures due to different physical phenomenon. Such concerns have been recently demonstrated for regular micro-architectures. In this work we demonstrate the vulnerability of field programmable gate arrays (FPGA)s to two different types of hard errors, namely, time dependent dielectric breakdown (TDDB) and electro-migration. We also analyze the performance degradation of FPGAs over time caused by hot carrier effects (HCE). We also propose three novel techniques to counter such aging based failures and increase the lifetime of the device