Role of the Spatial Distribution of Gas Flow for Tuning the Vertical/Planar Growth of Nonlayered Two-Dimensional Nanoplates
Role of the Spatial Distribution of Gas Flow for Tuning the Vertical/Planar Growth of Nonlayered Two-Dimensional Nanoplates
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气流空间分布对调节非层状二维纳米板垂直/平面生长的作用
DOI:
10.1021/acs.cgd.1c01261
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发表时间:
2021-12
影响因子:
3.8
通讯作者:
Fangping Ouyang
中科院分区:
文献类型:
--
作者:
Xukun Zhu;Lokwing Wong;Xiulian Fan;Jiong Zhao;Yu Zhou;Fangping Ouyang
Despite the difficulty in the orientational growth control for two-dimensional (2D) materials due to the large anisotropy of surface energy, here we propose a simple growth strategy by adjusting the spatial distribution of the gas flow to tune the vertical/planar growth of nonlayered Cr-based chalcogenide nanoplates. The vertical growth nucleation behaviors are directly related to the distribution of the gas flow and precursor concentration, which are formed by stacking silicon substrates to change the transportation behaviors of the precursor species. The elemental growth steps including nucleation, oriented growth, and the interface formation between the as-grown samples and substrates are characterized by electron microscopy, which concluded that the nucleation of the vertical nanoplates is either achieved from random pregrown polycrystalline nanocrystals or from the amorphous buffer layers. The thickness and density of the nanoplates can be controlled by tuning the height of the airflow barrier and growth conditions. Moreover, an electrostatic-assistance method has been developed to transfer the vertically grown nanoplates to arbitrary surfaces, which could retain very weak interaction with the substrate that largely reduces the electronic influence from the substrates. Our results not only provide a new universal vertical/planar growth method for 2D materials but also hint at a new possibility of pursuing intrinsic 2D magnetic properties and opening the door to explore various 2D magnetic applications and high surface-area-derived applications.
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影响因子:
4.7
作者:
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通讯作者:
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影响因子:
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16.6
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通讯作者:
Eychmueller, Alexander
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29.4
作者:
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通讯作者:
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