Fundamental studies of copper anode passivation during electrorefining .2. Surface morphology
Fundamental studies of copper anode passivation during electrorefining .2. Surface morphology
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DOI：
10.1007/bf02915659
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发表时间：
1996-08-01
影响因子：
3
通讯作者：
Hiskey, JB
中科院分区：
文献类型：
--
作者：
Cheng, X;Hiskey, JB
先前已通过进行电化学测量来分析商业铜阳极和纯铜的钝化。计时电位分析结果揭示了商业铜阳极的四个特征区域，包括 I-活性溶解、II-预钝化、III-钝化起始和 IV-钝化，而纯铜在所采用的条件下仅观察到活性溶解。为了建立表面形貌和钝化响应之间的关系，应用扫描电子显微镜 (SEM)、场发射扫描电子显微镜 (FESEM) 和能量色散 X 射线光谱 (EDS) 来表征商用铜阳极表面上形成的产物层的形貌，以获得独特的电化学区域。形貌研究表明，氧化铜表面膜的形成和稳定性对于钝化的发生和发展至关重要。阳极外层中存在的粘液层的结构和孔隙率影响氧化铜表面膜的稳定性，氧化铜表面膜主要控制钝化响应。
Passivation of commercial copper anodes and pure copper has been previously analyzed by performing electrochemical measurements. Chronopotentiometry results revealed four characteristic regions involving I-active dissolution, II-prepassivation, III-passivation onset, and IV-passivation, for commercial copper anodes, while only active dissolution was observed for pure copper under the conditions employed. In order to establish the relationship between surface morphology and passivation response, scanning electron microscopy (SEM), field emission scanning electron microscopy (FESEM), and energy dispersive X-ray spectroscopy (EDS) were applied to characterize morphology of the product layers formed on a commercial copper anode surface for the distinctive electrochemical regions. The morphology studies suggested that the formation and stability of copper oxide surface films are critical to the onset and development of passivation. The structure and porosity of the slimes layer present in the outer layer of the anode influence the stability of copper oxide surface films which dominantly control the passivation response.