Thermal shock analysis for a functionally graded plate with a surface crack
Thermal shock analysis for a functionally graded plate with a surface crack
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DOI：
10.1007/s00707-007-0562-5
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发表时间：
2008-01-01
期刊：
影响因子：
2.7
通讯作者：
Guo, L. -C.
中科院分区：
文献类型：
--
作者：
Noda, N.;Guo, L. -C.
研究了功能梯度材料（FGM）板在热冲击作用下的断裂行为。考虑表面裂纹。假设FGM板的热力学性能沿厚度方向变化。采用微扰法求解了瞬态温度场。然后得到瞬态热应力和相应的热应力强度因子（TSIF）。FGM陶瓷/金属（ZrO2/Ti-6Al-4V）板的瞬态热应力和TSIF如图所示。
The fracture behavior of a functionally graded material (FGM) plate subjected to a thermal shock is studied. A surface crack is considered. The thermomechanical properties of the FGM plate are assumed to vary along the thickness direction. By using a perturbation method, the transient temperature field is solved. Then the transient thermal stresses and the corresponding thermal stress intensity factor (TSIF) are obtained. The transient thermal stresses and TSIF in an FGM ceramic/metal (ZrO2/Ti-6Al-4V) plate are shown in figures.