Constitutive Modeling for SAC Lead-Free Solder based on Cyclic Loading Tests using Stepped Ramp Waves
Constitutive Modeling for SAC Lead-Free Solder based on Cyclic Loading Tests using Stepped Ramp Waves
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基于使用阶梯斜坡波的循环加载测试的 SAC 无铅焊料本构建模
DOI：
10.1016/j.proeng.2011.04.189
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
K. Sasaki
中科院分区：
文献类型：
--
作者：
K. Ohguchi;K. Sasaki
电子封装中焊点疲劳强度的有限元分析应采用能准确描述循环变形的本构模型。因此，应根据循环荷载作用下产生的非弹性应变的详细信息来构建模型。在此之前，我们研究了循环加载下Sn-Ag-Cu （SAC）无铅焊料的塑性应变和蠕变应变。在本研究中，我们基于试验结果，如应力-塑性应变关系，以及上述试验得到的应力-蠕变应变关系，构建了弹塑性蠕变本构模型。该模型考虑了循环加载中加载方向变化时的塑性变形和蠕变变形特征。利用该模型对不同加载条件下SAC焊料的循环加载进行了仿真，并与实验结果进行了比较。
Finite element analyses for evaluating fatigue strength of solder joints in electronic packages should employ a constitutive model which can describe cyclic deformations precisely. Therefore, the model should be constructed based on detailed information about the inelastic strain generated under the cyclic loading. We previously investigated both the plastic and creep strains of Sn-Ag-Cu (SAC) lead-free solder under cyclic loading experimentally by conducting cyclic loading tests using stepped ramp waves. In this study, we construct an elastic-plastic-creep constitutive model based on the experimental results, such as the stress-plastic strain relations, and the stress-creep strain relations obtained by the above-mentioned tests. The model considers the characteristics of the plastic and creep deformations in cyclic loading where loading direction changes. Simulations of cyclic loading of the SAC solder under several loading conditions are conducted using the proposed model and the results are compared with experiments.