TiN–Fe Vertically Aligned Nanocomposites Integrated on Silicon as a Multifunctional Platform toward Device Applications
TiN–Fe Vertically Aligned Nanocomposites Integrated on Silicon as a Multifunctional Platform toward Device Applications
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DOI:
10.3390/cryst12060849
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发表时间:
2022-06
期刊:
影响因子:
2.7
通讯作者:
M. Kalaswad;Di Zhang;Bethany X. Rutherford;Juanjuan Lu;J. P. Barnard;Zihao He;Juncheng Liu;Haohan Wang;Xiaoshan Xu;Haiyan Wang
中科院分区:
文献类型:
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作者:
M. Kalaswad;Di Zhang;Bethany X. Rutherford;Juanjuan Lu;J. P. Barnard;Zihao He;Juncheng Liu;Haohan Wang;Xiaoshan Xu;Haiyan Wang
Transition metal nitrides such as titanium nitride (TiN) possess exceptional mechanical-, chemical-, and thermal-stability and have been utilized in a wide variety of applications ranging from super-hard, corrosion-resistive, and decorative coatings to nanoscale diffusion barriers in semiconductor devices. Despite the ongoing interest in these robust materials, there have been limited reports focused on engineering high-aspect ratio TiN-based nanocomposites with anisotropic magnetic and optical properties. To this end, we explored TiN–Fe thin films with self-assembled vertical structures integrated on Si substrates. We showed that the key physical properties of the individual components (e.g., ferromagnetism from Fe) are preserved, that vertical nanostructures promote anisotropic behavior, and interactions between TiN and Fe enable a special magneto-optical response. This TiN–Fe nanocomposite system presents a new group of complex multifunctional hybrid materials that can be integrated on Si for future Si-based memory, optical, and biocompatible devices.