Programming material properties by tuning intermolecular bonding
Programming material properties by tuning intermolecular bonding
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DOI：
10.1063/5.0123058
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发表时间：
2022-12
影响因子：
3.2
通讯作者：
Upamanyu Ray;Zhenqian Pang;Teng Li
中科院分区：
文献类型：
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作者：
Upamanyu Ray;Zhenqian Pang;Teng Li
长期以来，传统的材料设计策略一直通过利用构成原子之间的主键（例如共价键、离子键和金属键）来使用。然而，破坏主键所需的键能很高。因此，在加工和制造此类材料时往往需要高温和巨大的能源消耗。相反，不同分子和官能团之间形成的分子间键（氢键、范德华力、静电相互作用、亚胺键等）比主键相对弱。因此，他们需要更少的精力来打破和改革。此外，分子间键可以在两个基团之间形成相当长的键长，而不受它们之间特定键角的限制，这是主键所缺乏的特征。这些特性激发了材料设计的非常规策略，通过调整组成原子或基团之间的分子间键合来实现优异的物理性能。本文回顾了此类利用分子间键合的策略的最新进展，并分析了此类设计策略如何提高所得材料的热稳定性和机械性能。还总结了通过调整分子间键合设计和制造的材料的应用，以及仍然存在的主要挑战和未来的前景，需要进一步关注通过调整分子间键合来最大限度地发挥编程材料性能的潜力。
Conventional strategies for materials design have long been used by leveraging primary bonding, such as covalent, ionic, and metallic bonds, between constituent atoms. However, bond energy required to break primary bonds is high. Therefore, high temperatures and enormous energy consumption are often required in processing and manufacturing such materials. On the contrary, intermolecular bonds (hydrogen bonds, van der Waals forces, electrostatic interactions, imine bonds, etc.) formed between different molecules and functional groups are relatively weaker than primary bonds. They, thus, require less energy to break and reform. Moreover, intermolecular bonds can form at considerably longer bond lengths between two groups with no constraint on a specific bond angle between them, a feature that primary bonds lack. These features motivate unconventional strategies for the material design by tuning the intermolecular bonding between constituent atoms or groups to achieve superior physical properties. This paper reviews recent development in such strategies that utilize intermolecular bonding and analyzes how such design strategies lead to enhanced thermal stability and mechanical properties of the resulting materials. The applications of the materials designed and fabricated by tuning the intermolecular bonding are also summarized, along with major challenges that remain and future perspectives that call for further attention to maximize the potential of programming material properties by tuning intermolecular bonding.