Microstructure and Properties of Rapidly Solidified Cu–0.81Cr–0.12Zr Alloy
Microstructure and Properties of Rapidly Solidified Cu–0.81Cr–0.12Zr Alloy
复制标题
快凝Cu-0.81Cr-0.12Zr合金的组织与性能
DOI：
10.2320/matertrans.m2013107
复制
发表时间：
2013
影响因子：
1.2
通讯作者：
Jinfu Li
中科院分区：
文献类型：
--
作者：
Zhenya Pan;Jiangbiao Chen;Wei Zhou;Jinfu Li
将Cu-0.81mass%Cr-0.12mass%Zr合金旋制成薄带，然后在不同温度下进行不同时间的时效处理。研究了其显微组织、显微硬度和导电性能。结果表明，常规条件下凝固的母合金锭由Cu基体、Cr和Cu 5 Zr三相组成。快淬使Cr、Zr完全固溶于铜基体中。随着时效的进行，Cr和Cu 5 Zr相再次从基体中析出。在773 K时效15 min的薄带具有最好的性能：显微硬度为212 HV，电导率为78.9%IACS。与传统工艺（对大块合金锭进行均匀化处理，然后进行时效处理）相比，使用快速淬火可使显微硬度提高一倍，而电导率仅略有降低。[doi：10.2320/matertrans.M2013107]
Cu0.81mass%Cr0.12mass%Zr alloy was spun into ribbon and then aged at different temperatures for different time. The microstructure, microhardness and electrical conductivity were investigated. It is found that the mother alloy ingot solidified under conventional conditions consists of three phases: Cu matrix, Cr and Cu5Zr. Rapid quenching makes Cr and Zr fully dissolve into the copper matrix. As the aging proceeds, Cr and Cu5Zr phases precipitate again from the matrix. The ribbon aged at 773K for 15min possesses the best property: a microhardness of 212HVand an electrical conductivity of 78.9% IACS. Compared with the conventional process (homogenization treatment of a bulk alloy ingot followed by aging), the use of rapid quenching doubles the microhardness while only slightly decreasing the electrical conductivity. [doi:10.2320/matertrans.M2013107]