Approach to the numerical modelling of the chip temperatures in single grain scratching
Approach to the numerical modelling of the chip temperatures in single grain scratching
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DOI：
10.1007/s11740-021-01017-7
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发表时间：
2021-01-30
影响因子：
1.7
通讯作者：
Prinz, Sebastian
中科院分区：
文献类型：
--
作者：
Bergs, Thomas;Roettger, Jannik;Prinz, Sebastian
为了对磨削过程中接触区的物理机制和热生成有一个基本的认识，进行了大量的实验和数值研究来分析单晶粒与工件的相互作用。现有的晶粒与工件相互作用的数值模型不能很好地反映实际情况，特别是不能很好地反映晶粒三维几何形状对单晶粒刻划过程温度的影响。由于在实验研究中没有适当的测量方法，因此尚未对模拟温度进行实验验证。本文建立了cbn晶粒与工件（100Cr6）磨削过程中相互作用的三维有限元模型。该模型预测了实际晶粒几何形状的切屑温度，以研究晶粒与工件之间的相互作用。利用比例高温计进行了验证模型的实验。
To achieve a fundamental understanding of the physical mechanisms and the heat generation in the contact zone during grinding, a large number of experimental and numerical investigations have been carried out to analyse the interaction of single grain and workpiece. Existing numerical models of the interaction between grain and workpiece do not represent the reality and especially the influence of the three-dimensional grain geometry on the temperatures during single grain scratching with sufficient accuracy. An experimental validation of the simulated temperatures has not been carried out yet as there is no appropriate method to measure them in experimental investigations. In this study, a three-dimensional FE-model of the interaction between CBN-grain and workpiece (100Cr6) in the grinding process is presented. The model predicts the chip temperatures for real grain geometries to investigate the interactions between grain and workpiece. The experiments to validate the model were carried out using a ratio pyrometer.