Thick epoxy resist sheets for MEMS manufactuing and packaging
Thick epoxy resist sheets for MEMS manufactuing and packaging
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用于 MEMS 制造和封装的厚环氧树脂抗蚀剂片
DOI：
10.1109/memsys.2010.5442479
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发表时间：
2010
期刊：
影响因子：
--
通讯作者：
Wen. Dai
中科院分区：
文献类型：
--
作者：
Don Johnson;A. Voigt;G. Ahrens;Wen. Dai
我们描述了一种新的 SUEX 厚环氧抗蚀剂片材系列，该片材已根据基材尺寸进行预切割，厚度可制成 100μm 至 1mm 以上。这些片材只需层压到基材表面即可在几分钟内投入使用。我们将描述我们开发的无锑厚干膜环氧树脂片 (TDFS) 的初步结果，以考虑作为下一代多用途 MEMS 材料。 SUEX 片材比目前可用的其他环氧抗蚀剂薄膜具有更高的透明度，使其非常适合厚抗蚀剂应用。初步结果显示出出色的均匀性、分辨率和侧壁轮廓。
We describe a new line of SUEX thick epoxy resist sheets which are pre-cut to substrate dimensions and can be made to thicknesses of 100µm to more than 1mm. The sheets need only to be laminated to a substrate surface and are ready to use in minutes. We will describe the preliminary results of our developmental antimony-free thick dry film epoxy sheets (TDFS) for consideration as a next generation multi-purpose MEMS material. SUEX sheets show higher transparency than other currently available epoxy resist films making them highly suited for thick resist applications. The initial results show excellent uniformity, resolution and side wall profiles.