Free stream cooling of a stack of parallel plates
Free stream cooling of a stack of parallel plates
复制标题
一堆平行板的自由流冷却
DOI：
10.1016/0017-9310(94)00123-d
复制
发表时间：
1995
期刊：
影响因子：
--
通讯作者：
S. W. Lee
中科院分区：
文献类型：
--
作者：
A. Morega;A. Bejan;S. W. Lee
本文讨论了基本的传热增强问题，如何安排一堆平行板（如散热片，印刷电路板）在一个自由的流，使堆栈和流之间的热阻是最小的。它表明，最好的方式来定位板相对于彼此是通过间隔它们等距。当电池堆的整体尺寸被指定时，存在最佳的板数以获得最小的热阻。最佳数量和最小阻力是理论上预期的，并与ReLrange 102-104中的数值和实验结果一致的紧凑公式相关联。最后，它示出了一个堆栈与更多的板比最佳数量可以更方便地建模为一个多孔块浸没在自由流。
This paper addresses the fundamental heat transfer augmentation question of how to arrange a stack of parallel plates (e.g. fins of heat sink, printed circuit boards) in a free stream such that the thermal resistance between the stack and the stream is minimum. It is shown that the best way of positioning the plates relative to one another is by spacing them equidistantly. When the overall dimensions of the stack are specified, there is an optimal number of plates for minimum thermal resistance. The optimal number and minimum resistance are anticipated theoretically and correlated into compact formulas that agree with numerical and experimental results in the ReLrange 102-104. Finally, it is shown that a stack with more plates than the optimal number can be modeled more expediently as a porous block immersed in a free stream.