Towards Reliable Smart Textiles: Investigating Thermal Characterisation of Embedded Electronics in E-Textiles Using Infrared Thermography and Mathematical Modelling

Towards Reliable Smart Textiles: Investigating Thermal Characterisation of Embedded Electronics in E-Textiles Using Infrared Thermography and Mathematical Modelling
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DOI:
10.1016/j.sna.2022.113501
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发表时间:
2022-03
期刊:
Sensors and Actuators A: Physical
影响因子:
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通讯作者:
Lama Hamadeh;A. Al-Habaibeh
Lama Hamadeh;A. Al-Habaibeh
中科院分区:
其他
文献类型:
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作者:
Lama Hamadeh;A. Al-Habaibeh

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近年来,包括电子纺织品在内的智能纺织品领域因其在可穿戴设备、建筑、能源和产品设计等领域的广泛市场应用而得到了快速发展。电子纺织品的电子电路包括嵌入纱线中的led、传感器和电池等设备。由于温度是一个关键因素,当它超过一定的阈值时,会对电子设备产生深远的问题,因此必须进行广泛的研究工作,以减少其负面影响并提高此类嵌入式设备的可持续性。在这项工作中,利用红外热成像技术实验研究了led在电子纱制造阶段的裸态、封装态和嵌入态的热分布曲线。将实验结果与求解传热过程时变方程和偏微分方程的数值分析模型进行了比较。在这项工作中,利用320 × 240像素氧化钒微测热仪的红外摄像机,检测小于0.1°K的温差,并使用特殊的微特写镜头拍摄LED样品的近距离红外图像。此外,使用热电偶的点测量技术可确保记录准确的温度测量以进行校准。这项工作的结果证明,使用红外热像仪与合适的透镜可以提供有关智能纺织品的热行为的重要信息。结果表明,集成发光二极管的热分布具有类高斯分布。在特定距离范围内,通过在电路中添加额外的LED器件,这种钟形分布变得更高更宽。研究发现,在多个led的情况下,它们之间的距离在决定系统的整体温度和塑造最终的整体热分布方面起着至关重要的作用,因此从长远来看,智能纺织品的可靠性。结果还表明,包纱对织物的散热有一定的影响。因此,纱线的材料和结构的选择可能是电子纺织品中嵌入的电子设备热性能的关键因素。
The smart textiles field, which includes e-textiles, has seen rapid development in recent years due to its wide market applications such as wearables, architecture, energy and product design. Electronic circuits of e-textiles involve devices such as LEDs, sensors and batteries that are embedded within the yarns. Since temperature is a crucial element causing profound problems to the electronic devices when it exceeds a certain threshold, extensive research efforts have to be done to reduce its negative effect and enhance the sustainability of such embedded devices. In this work, infrared thermographic imaging technology is utilised to experimentally study the thermal distribution profile of LEDs in their bare, encapsulated and embedded state in e-yarns manufacturing stages. The experimental results are compared with numerical analysis models carried out when solving the time-dependent and partial differential equations of the heat transfer process. In this work, infrared camera with 320 × 240 pixel vanadium oxide microbolometer that detects temperature differences of less than 0.1 °K is utilised with a special micro close-up lens to take close-up infrared images of the LED samples. Additionally a point-measurement technique, using a thermocouple, is utilised to ensure accurate temperature measurements are recorded for calibration. The results of this work prove that using infrared thermography with suitable lens can provide significant information about the thermal behaviour of smart textiles. It has been found that the thermal distribution of the integrated LEDs has a Gaussian-like shape. This bell-shaped distribution gets higher and wider by adding an additional LED device to the circuit within a specific distance range. It has been found that in the case of multiple LEDs, the distance between them plays a crucial role in determining the overall temperature of the system and shaping the final overall thermal distribution, and hence the reliability of the smart textile on the long term. The results also show that the cover yarn can influence the heat dissipation process. Consequently, the selection of yarn’s material and structure could be a critical factor to the thermal performance of electronic devices embedded within e-textiles.